Interning @ Mercury System's Microelectronics Packaging Center in Phoenix

Over nearly two years at Mercury Systems Microelectronics Packaging Center in Phoenix, I supported manufacturing engineering across PCB fabrication, wafer packaging, and failure analysis. I worked continuously across semesters, gaining hands-on experience in cleanroom operations, lab diagnostics, and design software.

Picture: General Printed Circuit Board Fabrication & Packaging Floor, 1st View

Wafer Fabrication Floor: Manufacturing Operations & Packaging

• Supported PCB fabrication and packaging operations
• Assisted wafer packaging development for 200mm and 300mm wafers
• Performed failure analysis using SEM and 3D CT X-ray
• Used Siemens NX, SolidWorks, and Minitab for design and analysis

Picture: Sample Thermal Humidity Testing Chambers for Printed Circuit Board Assemblies

Failure Analysis Lab: Destructive Testing, Non-Destructive Testing (NDT) & Analysis

• Supported PCB fabrication and packaging operations
• Assisted wafer packaging development for 200mm and 300mm wafers
• Performed failure analysis using SEM and 3D CT X-ray
• Used Siemens NX, SolidWorks, and Minitab for design and analysis

Picture: Scanning Electron Microscope Scans of Ball Grid Array Solder Balls

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Microelectronics Packaging Floor: Manufacturing Operations, Packaging & Quality Assurance

• Supported PCB fabrication and packaging operations
• Assisted wafer packaging development for 200mm and 300mm wafers
• Performed failure analysis using SEM and 3D CT X-ray
• Used Siemens NX, SolidWorks, and Minitab for design and analysis

Picture: PCB Manufacturing Process | Conformal Coating (Left), Conformal Coating Inspection (Right, all three)

Picture: Coupon Board Inspection under High-powered Microscope

Cleanroom Operations & Wafer Packaging

• Supported PCB fabrication and packaging operations
• Assisted wafer packaging development for 200mm and 300mm wafers
• Performed failure analysis using SEM and 3D CT X-ray
• Used Siemens NX, SolidWorks, and Minitab for design and analysis

Cleanroom Operations & Wafer Packaging

• Supported PCB fabrication and packaging operations
• Assisted wafer packaging development for 200mm and 300mm wafers
• Performed failure analysis using SEM and 3D CT X-ray
• Used Siemens NX, SolidWorks, and Minitab for design and analysis

For example, some of the projects I was involved in were to support our cleanroom floor that was dedicated to wafer packaging. The goal was to bring about new business in the form of building end-to-end packaging processes for 200mm [8"] and 300mm [12"] wafers from the ground up. So to be an effective aide to the engineers, I learned how to use all the equipment in our wafer cleanroom. This included dicing saws, plasma clean stations, dispensing equipment, metrology equipment, etc.

• Collaborated with operators and engineers to validate coating coverage and inspection criteria
• Assisted wafer packaging development for 200mm and 300mm wafers
• Performed failure analysis using SEM and 3D CT X-ray
• Used Siemens NX, SolidWorks, and Minitab for design and analysis

Picture: Sample 3D CT X-ray Scan using efX Software

Picture: PCB Router Setup for Depaneling

Picture: Teledyne LeCroy WavePulser 40iX's Time Domain Reflectometry Software

Mechanical Subsystem Design

H

Recovery, Redundancy, and Contingency Plans

f

Manufacturing and Procurement

I

Verification

I validated designs through CMM inspections, FEA for structural loads, and thermal cycling tests, achieving TRL 7 for mechanical subsystems.

Summary

• Delivered mission-ready designs for a 2030 lunar launch under $300M budget.
• Achieved TRL 7, enabling lunar pit exploration.
• Mastered CAD, FEA, and systems integration.
• Led a top-performing team, enhancing my aerospace expertise.

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